Interfaces, Confinement, Matériaux et Nanostructures - ICMN

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Mardi 25 Juin 2013

14h30 Bibliothèque du CRMD

Non-porous Hybrid Gels and their application for the hermetic barriers for microelectronics

Dr. Andrei Jitianu - Lehman College - New York

Résumé :

Hermetic barriers are desirable materials for electronic industry. These are an essential part of microelectronics, micro-electromechanical systems (MEMS), displays using organic-light emitting diodes (OLEDs) and electrochemical devices, such as microbatteries. The hermetic seals prevent the penetration of outside contaminants such as humidity and other gases to infiltrate into electronic devices and degrading their performance.

Due to their low temperatures of softening and consolidation the hybrid organic-inorganic melting gels can be used for hermetic barrier applications. Two important properties of the melting gels make them usable as a hermetic barrier ; one is their high hydrophobicity and second is their lack of porosity. The main objective is to fabricate the hermetic barrier materials which have low temperature of processability and high hydrophobicity.

The hybrid melting gels were synthesized by the sol-gel method using mono-substituted silanes such as methyltriethoxysilane (MTES) and di-substituted silanes such as dimethyldiethoxysilane (DEDMS). The mixtures and the resulting melting gels have been characterized for their softening temperatures and consolidation temperatures. With an interest in using these materials for sealing microelectronics, their physical properties have been measured.